Boardoza Sensor Applications
Pulse S32-S3 Development Board
Overview
The Boardoza Pulse S32-S3 is a high-performance, industrial-grade development breakout board built around the Espressif ESP32-S3-WROOM-1-N4R2 module. Engineered for rapid prototyping and seamless deployment, this board integrates advanced connectivity with robust power management in a standardized 60x60mm form factor.
Designed for professional firmware developers and hardware engineers, the Pulse S32-S3 bridges the gap between evaluation and production-ready embedded systems, specifically targeting IoT, smart industrial automation, and edge computing applications.
Core Technical Specifications
MCU Core: Dual-core 32-bit Xtensa® LX7 microprocessor running up to 240 MHz.
Memory Architecture:
Internal SRAM: 512 KB
External Flash: 8 MB (via QSPI)
External PSRAM: 2 MB (Optimized for memory-intensive AI and DSP tasks)
Wireless Connectivity: * Wi-Fi: IEEE 802.11 b/g/n (up to 150 Mbps)
Bluetooth: Bluetooth 5 (LE) with Long Range support.
Power Management:
Dual-source input via USB Type-C (5V) or 1S Li-Ion Battery (3.7V).
Optimized LDO regulators for ultra-low power consumption in Deep Sleep mode.
On-board battery charging circuit for portable deployment.
Form Factor: Industrial-standard 60x60mm PCB layout for modular compatibility.
Hardware Interfaces & Connectivity
The Pulse S32-S3 is designed with a rich peripheral set to ensure maximum flexibility for sensor fusion and actuator control:
I2C Interface (J3 Connector): Dedicated bus for seamless sensor integration.
UART Interface (J4 Connector): High-speed asynchronous communication for telemetry and debugging.
Extensive GPIO Header: 22 multi-function GPIO pins supporting SPI, PWM, ADC, and DAC functionalities.
Visual Feedback: Integrated Addressable RGB LED for status monitoring and diagnostic signaling.
Key Engineering Features
AI Acceleration & Signal Processing
The ESP32-S3 silicon includes dedicated vector instructions for accelerating Artificial Intelligence (AI) workloads and Digital Signal Processing (DSP). This makes the Pulse S32-S3 an ideal platform for high-performance edge inference and voice recognition.
Robust Power Path Management
The board features an intelligent power switching mechanism between USB and Battery inputs, ensuring continuous operation for field-deployed devices. The integrated 3.3V LDO provides stable voltage rails even under high peak currents during wireless transmission.
Ecosystem Compatibility
Fully compatible with modern development environments, including:
ESP-IDF (Native SDK)
Arduino IDE
PlatformIO
MicroPython / CircuitPython
Applications
Industrial IoT (IIoT): Edge data processing and gateway communication.
Smart Home Systems: Centralized control hubs with voice assistant capabilities.
Wearable Technology: Energy-efficient, battery-powered health and fitness trackers.
Remote Sensing: Long-range telemetry using Wi-Fi/BLE mesh networking.
Board Dimensions
Boardoza Vibration Motor Driver Breakout Board
Overview
The Boardoza Vibration Motor Driver is a specialized, compact breakout board designed for precision control of DC vibration motors (ERM) and Linear Resonant Actuators (LRA). Engineered for haptic feedback applications, this module provides a seamless interface between low-power microcontrollers (such as ESP32, STM32, or Arduino) and high-current vibration motors.
With its 25x25mm ultra-compact footprint, it is an ideal solution for wearable devices, handheld controllers, and industrial alert systems where tactile notification is required.
Core Technical Specifications
Driver Topology: High-efficiency MOSFET-based driver circuit optimized for inductive loads.
Input Voltage (): Compatible with standard logic levels (3.3V to 5V).
Control Interface: * PWM Capable: Supports Pulse Width Modulation for adjustable vibration intensity.
Digital Logic: Simple ON/OFF control via GPIO.
Form Factor: 25x25mm PCB — optimized for space-constrained embedded designs.
Connector Interface: * Input: Standard 0.1" (2.54mm) pitch headers for breadboard and jumper wire compatibility.
Output: Dedicated motor output pads for secure soldering or JST connector integration.
Key Engineering Features
Precise Haptic Control
Unlike direct GPIO driving, which can damage microcontroller pins due to back-EMF (Electromotive Force), this breakout board features integrated flyback protection. This ensures the safety of your MCU while allowing for high-frequency PWM switching to create complex haptic patterns (e.g., varying pulse strengths, ramps, and patterns).
Low Power Consumption
Designed with mobile and battery-operated applications in mind, the driver minimizes quiescent current draw, ensuring that the vibration system does not significantly impact the overall power budget of the device during idle states.
Modular Integration
The standardized pinout allows for rapid integration into existing prototyping ecosystems. The board serves as a robust power stage, translating low-current logic signals into the high-current drive required by eccentric rotating mass (ERM) motors.
Applications
Wearable Haptics: Silent alerts for smartwatches and fitness trackers.
User Interface Feedback: Tactile confirmation for touchless buttons or industrial panels.
Alert Systems: Non-visual notification systems for noisy industrial environments.
Medical Devices: Discrete vibration prompts for patient monitoring equipment.
Ordering Information
The Boardoza Vibration Motor Driver is available for global shipping via our official channels.
Direct Purchase: Coming Soon...
RFM6601W LoRa Module
Overview
The Boardoza RFM6601W is a high-performance, ultra-low-power SoC (System on Chip) LoRa module designed for long-range wireless data communication. Based on the robust RFM6601W engine, this module integrates a 32-bit MCU and a powerful LoRa transceiver into a single package, making it an ideal choice for LPWAN (Low Power Wide Area Network) applications.
Engineered for reliability in harsh environments, it provides deep indoor penetration and extreme outdoor range, making it the backbone for smart agriculture, utility metering, and industrial tracking systems.
Core Technical Specifications
Microcontroller: Integrated 32-bit RISC MCU (optimized for low-power operation).
Radio Transceiver: High-sensitivity LoRa® modulation engine.
Frequency Range: 868 MHz / 915 MHz (Region dependent).
Maximum Output Power: Up to +22 dBm (Programmable).
Sensitivity: Down to -148 dBm (Enabling extreme long-range links).
Modulation Schemes: LoRa, (G)FSK, (G)MSK, and BPSK.
Power Consumption:
Deep Sleep: < 2µA (Ideal for multi-year battery operation).
RX Mode: ~4.5mA (Ultra-low power reception).
Interfaces: Multi-channel UART, SPI, I2C, and GPIOs for peripheral sensor integration.
Key Engineering Features
Industrial-Grade LPWAN Capability
The RFM6601W leverages LoRa modulation technology to achieve significantly higher range than traditional FSK or OOK systems. Its high interference immunity ensures stable data transmission in RF-congested environments.
SoC Architecture
By integrating the MCU and the RF front-end on a single die, the RFM6601W reduces the overall PCB footprint and simplifies the hardware design. This eliminates the need for an external controller, reducing the Bill of Materials (BOM) cost for large-scale deployments.
Advanced Power Management
The module is designed with a sophisticated power distribution unit (PDU) that supports wide voltage input ranges. Its ultra-low sleep current allows for deployment in remote locations using only a small Li-SoCl2 battery or energy harvesting sources.
Applications
Smart Agriculture: Soil moisture monitoring and automated irrigation control over several kilometers.
Industrial Monitoring: Wireless sensor networks for factory automation and predictive maintenance.
Smart City Infrastructure: Remote utility metering (water, gas, electricity) and street lighting control.
Asset Tracking: Long-range GPS tracking for logistics and livestock management.
Ensure your project has the range it deserves with the RFM6601W.
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